High-Precision, Non-Contact 3D Displacement and Strain Measurement
The Revealer Digital Image Correlation (DIC) Quasi-Static Strain Measurement System is an advanced optical measurement solution designed for accurate, non-contact analysis of material deformation and strain.
The system combines two high-resolution cameras, a synchronisation trigger, RVM measurement software, calibration plates and a dedicated graphics workstation to capture and analyse material behaviour under static and dynamic loading conditions.
Using advanced image correlation technology, it provides precise 3D coordinate, displacement and full-field strain measurements, making it ideal for material testing, mechanical engineering and research applications.
Key Features
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High-resolution imaging: Two cameras provide up to 12-megapixel non-contact measurement capability.
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High-precision displacement analysis: Advanced sub-pixel recognition algorithms deliver displacement accuracy of up to 0.01 pixel.
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Full-field measurement: Captures displacement and strain distributions across the entire specimen surface.
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3D measurement capability: Measures three-dimensional coordinates, displacement and strain.
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Intelligent voice interaction: Supports voice-controlled sampling for convenient operation.
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User-friendly software: RVM measurement software simplifies data acquisition, processing and analysis.
Technical Specifications
| Specification | RVM-STD-DH500 | RVM-STD-DH1200 | RVM-STD-BM1200 |
|---|---|---|---|
| Number of cameras | 2 | 2 | 2 |
| Resolution | 2448 × 2048 | 4096 × 3000 | 4096 × 3000 |
| Full-frame rate | 75 fps | 30.5 fps | 29 fps |
| Measurement field of view | 10–500 mm | 10–1000 mm | 10–1000 mm |
| Displacement accuracy | ≤0.01 pixel | ≤0.01 pixel | ≤0.01 pixel |
| Strain accuracy | ≤100 με | ≤50 με | ≤50 με |
| Strain measurement range | 0.005%–2000% | 0.005%–2000% | 0.005%–2000% |
Applications
The DIC Quasi-Static Strain Measurement System is suitable for a wide range of scientific research, material testing and engineering applications, including:
Aerospace Engineering
Optical measurement and deformation analysis of aerospace components, structures and materials.
Mechanical Engineering
Evaluation of component deformation, displacement and strain under mechanical loading and operating conditions.
Mechanics of Materials
Full-field strain analysis and material characterisation to investigate mechanical properties and structural behaviour.
Biomedical Research
Non-contact measurement and deformation analysis of biological materials, medical devices and biomedical components.