Advanced Non-Contact Strain and Deformation Measurement at Elevated Temperatures
The Digital Image Correlation (DIC) High-Temperature Strain Measurement System is designed for the analysis of material properties and deformation behaviour under high-temperature conditions. It is particularly suited to demanding research and testing applications in aerospace, marine engineering and advanced materials development.
Combining two high-resolution cameras with an infrared thermal imaging camera, the system simultaneously captures specimen deformation, displacement, strain and temperature data. The integrated system also includes a synchronisation trigger, RVM measurement software, calibration plates and a dedicated graphics workstation.
Using advanced optical measurement and image correlation technology, the system enables accurate, non-contact, full-field strain analysis at temperatures of up to 1500°C (optional configuration), making it ideal for investigating material performance under extreme thermal conditions.
Key Features
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High-temperature measurement: Supports temperature measurement up to 550°C as standard, with an optional extended range of up to 1500°C.
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Integrated thermal imaging: Combines high-resolution optical cameras with infrared imaging to monitor temperature and material deformation.
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High-precision displacement analysis: Advanced sub-pixel recognition algorithms provide displacement accuracy of up to 0.01 pixel.
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Full-field measurement: Captures displacement and strain distributions across the specimen surface.
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Simultaneous measurement: Enables analysis of strain, displacement and temperature during high-temperature testing.
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Intelligent voice interaction: Supports voice-controlled sampling for convenient operation.
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User-friendly software: RVM measurement software simplifies data acquisition, processing and analysis.
Technical Specifications
| Specification | RVM-IR |
|---|---|
| Camera configuration | 2 × high-resolution cameras + 1 × infrared camera |
| Optical camera resolution | 2448 × 2048 |
| Optical camera resolution and frame rate | 4096 × 3000 @ 29 fps |
| Infrared resolution and frame rate | 640 × 512 @ 25 Hz |
| Displacement accuracy | 0.01 pixel |
| Strain accuracy | ≤50 με |
| Strain measurement range | 0.005%–2000% |
| Temperature measurement range | -20°C to +550°C (up to 1500°C optional) |
| NETD (Noise Equivalent Temperature Difference) | ≤50 mK |
Applications
The DIC High-Temperature Strain Measurement System is suitable for advanced material testing and research where understanding the relationship between temperature, deformation and mechanical performance is critical.
Aerospace Engineering
Analysis of material deformation and thermal behaviour in aerospace components and structures exposed to elevated temperatures.
Mechanical Engineering
Evaluation of mechanical performance, thermal deformation and strain distribution in components operating under demanding temperature conditions.
Mechanics of Materials
Investigation of material properties, thermal expansion, deformation and strain behaviour under high-temperature loading.
Biomedical and Advanced Materials Research
Non-contact deformation and strain analysis of specialised materials and components for research and development applications.